Overcoming the challenges of fiber-to-silicon photonic integrated circuit coupling on a single-chip glass chip opto-cplrlt.

Opto-cplrlt? The aim is to overcome the challenges of fiber-to-silicon photonic integrated circuits (PIC) coupling to achieve high-volume automated assembly and to help reduce costs. Opto-cplrlt? OPTOSCRIBE's proprietary high-speed laser writing technology features a low-loss optical bend mirror uniquely formed in glass that directs light to or from a SIPH grating coupler. This avoids the need for bend resistant fiber optic solutions, which are often expensive, challenging, and have some significant limitations in size and shape. To help solve the footprint challenge, OptoCplrLT? With a low profile interface height less than 1.5 mm, the compact interface layout can be achieved, thereby reducing packaging constraints. It is also compatible with industry standard materials and processes; for example, glass chips have Coefficient of thermal expansion that match silicon chips to help maximize performance. As data center operators and transceiver makers look for innovative solutions to help address the challenge of fiber to Siph PIC coupling, we are pleased to introduce OptoCplrLT? To help meet market demand for performance, cost and volume, and to help overcome barriers including SIPH transceiver packaging and integration, oPTOSCRIBE launches OptoArray? , a new family of the best of its kind precision fiber alignment structures that can address many of the challenges posed by high-density optical connections. I mean, you know, like,? It has been mass-produced with one of the major manufacturers in the optical switch market and has gained the favor of other major customers in the optical cross-connect (OXC) switch, wavelength selective switch (WSS) and optical connector markets. I mean, you know, like,? The solution can be used for a wide range of applications, including multi-fiber connectors, arrays for connecting optical switching hardware such as reconfigurable optical add-drop multiplexers (Roadm) , and other free-space optical systems. OPTOSCRIBE's high-speed laser-induced selective etching process provides complete 3d flexibility for array patterning and creates high-precision, controllable microstructures in glass. This is a novel two-stage glass microtexturing process that uses focused ultrashort laser pulses to induce subsurface material patterning and to locate the focus of the laser beam. By rapidly scanning the three-dimensional shapes within the glass, regions are created that increase the etching rate, so that the exposed regions are preferentially etched when the substrate is exposed to wet chemical etching. The main difference between laser-induced selective etching and silicon patterning is its adaptability, which is a key factor in a fast-growing industry. For example, because silicon patterning relies on existing MEMS technologies and fabrication facilities, the tools used to make 2d arrays can only produce a standard wafer thickness, typically 650 microns thick. Given that a two-dimensional array requires several millimeters of thickness to provide mechanical rigidity and integrity to maintain the position of the fiber, three patterned two-dimensional arrays of silicon are usually stacked and bonded together to produce the required thickness. This not only creates additional unnecessary processing steps and costs, but also introduces a potential new stacking misalignment error. In contrast, laser-induced selective etching can be performed on substantially thicker glass substrates, such as 2mm. Another important feature that highlights the adaptability of laser-induced selective etching is the free-form control of the hole shape in the entire substrate volume. The Free Form 3d control also means that the entrance to the hole can be modified to any desired shape. Although the silicon pattern can produce a horn hole to allow simple fiber insertion, the horn must be a standard-sized cone shape. Laser-induced selective etching can produce different lengths of curved or tapered flared mouths, depending on demand. An important advantage of free-form three-dimensional control is the ability to form holes at any angle on the surface of the glass and the opportunity to minimize back reflection. These functions are beyond the reach of silicon graphics.